Обозначение | Заглавие на русском языке | Статус | Язык документа | Цена (с НДС 20%) в рублях |
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Device embedded substrate - Part 2-2: Guidelines - Electrical testing
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Device embedding assembly technology - Part 2-7: Guidelines - Accelerated stress testing of passive embedded circuit boards
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Device embedding assembly technology - Part 2-8: Guidelines - Warpage control of active device embedded substrate
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Printed electronics - Part 250: Materials technologies required in printed electronics for wearable smart devices
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Power capacitors for induction heating installations - Part 2: Ageing test, destruction test and requirements for disconnecting internal fuses
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Estimation of the reliability of electrical connectors
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Piezoelectric, dielectric and electrostatic devices and associated materials for frequency control, selection and detection - Glossary - Part 3: Piezoelectric, dielectric and electrostatic oscillators
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Device embedded substrate - Part 2-1: Guidelines - General description of technology
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Device embedded substrate - Part 2-3: Guidelines - Design guide
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Device embedded substrate - Part 2-4: Guidelines - Test element groups(TEG)
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Information technology - Telecommunications and information exchange between systems - Interface connector and contact assignments for ISDN basic access interface located at reference points S and T
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Wearable electronic devices and technologies - Part 406-1: Test method for measuring surface temperature of wrist-worn wearable electronic devices while in contact with human skin
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